?mounting instructions high temperature soldering guaranteed: 260 ? ?10 sc. recommended mounting torque: 8 kg.cm. fbi1.5b 5s2 100 40 fbi1.5b5s2.......fbi1.5m5s2 1.5 amp. glass passivated bridge rectifier dimensions in mm. maximum ratings, according to iec publication no. 134 i frm i fsm i 2 t v dis t j t stg 4.0 a at 65 ? 1.5 a at 25 ? 10 a 50 a 12 a 2 sec 1500 v ?40 to + 150 ? ?40 to +150 ? electrical characteristics at tamb = 25? v f max. forward voltage drop per element at i f = 1 a i r 5 m a 1.1 v max. reverse current per element at v rrm voltage 100 to 1000 v. current 1.5 a. v rrm v r i f(av) peak recurrent reverse voltage (v) recommended input voltage (v) max. average forward current with heatsink without heatsink fbi1.5d 5s2 200 80 fbi1.5f 5s2 300 125 fbi1.5j 5s2 600 250 fbi1.5l 5s2 900 380 fbi1.5m 5s2 1000 500 plastic case recurrent peak forward current 10 ms. peak forward surge current i 2 t value for fusing (t = 10 ms) dielectric strength (terminals to case, ac 1 min.) operating temperature range storage temperature range maximum thermal resistance junction-case. with heatsink. junction-ambient. without heatsink. 12 ?/w 45 ?/w r th (j-c) r th (j-a) 20 5 1 0.5 3.5 + _ 5 5 1.5 1 + 0.05 1.5 l suffix 13.5 7 ? ?glass passivated junction chips. ul recognized under component index file number e130180. lead and polarity identifications. case: molded plastic. ideal for printed circuit board (p.c.b.). the plastic material carries u/l recognition 94 v-o. jan - 00 70 v rms maximum rms voltage (v) 140 210 420 630 700
v f , instantaneous forward voltage (v) 0.6 1.0 1.4 0 0.1 1.0 10 tamb = 25?c characteristic curves fbi1.5 - 5s2 tamb, ambient temperature ( c) 1 2 3 4 0 50 100 150 175 0 125 25 75 number of cycles at 50 hz. 10 100 0 10 20 30 40 50 60 typical forward characteristic forward current derating curve maximum non-repetitive peak forward surge current 1 heatsink tc tc sine wave r-load on heatsink + _ on glass-epoxi substrate p.c.b. soldering land 5 mm sine wave r-load free in air jan - 00 + _
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